職位描述
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The Day-to-Day
- Design, develop and scale to volume production of high voltage/high power packages and modules for the industrial, automotive, renewable and telecom markets.
- The candidate can understand system requirements and build these into the definition of the package to meet electrical, thermal, and mechanical specifications.
- The candidate can identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds.
- The candidate can be capable of developing new process flows/technologies necessary for building prototypes.
- The candidate can outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection.
- The candidate must have a broad knowledge of the package materials (molding compound, die attach, substrate etc) for high voltage/high power packages and modules.
Minimum Qualifications:
- BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree
- 3 year of experience in design of high voltage/high power packages and modules across MOSFET, IGBT, SiC, GaN technologies.
- Proficiency in CAD software, SolidWorks / Auto CAD preferred.
- Knowledge in various packaging technology, process flow, material, qualification and manufacturing implementation.
- Knowledge in high voltage/high power package reliability requirements, failure analysis techniques, assembly process issues, etc.
- Therlectrical, stress simulation skills are a plus.
- Strong communication, presentation, and interpersonal skills.
- Problem-solving mindset.
- Design, develop and scale to volume production of high voltage/high power packages and modules for the industrial, automotive, renewable and telecom markets.
- The candidate can understand system requirements and build these into the definition of the package to meet electrical, thermal, and mechanical specifications.
- The candidate can identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds.
- The candidate can be capable of developing new process flows/technologies necessary for building prototypes.
- The candidate can outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection.
- The candidate must have a broad knowledge of the package materials (molding compound, die attach, substrate etc) for high voltage/high power packages and modules.
Minimum Qualifications:
- BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree
- 3 year of experience in design of high voltage/high power packages and modules across MOSFET, IGBT, SiC, GaN technologies.
- Proficiency in CAD software, SolidWorks / Auto CAD preferred.
- Knowledge in various packaging technology, process flow, material, qualification and manufacturing implementation.
- Knowledge in high voltage/high power package reliability requirements, failure analysis techniques, assembly process issues, etc.
- Therlectrical, stress simulation skills are a plus.
- Strong communication, presentation, and interpersonal skills.
- Problem-solving mindset.
工作地點
地址:成都郫都區(qū)郫都區(qū)成都高新綜合保稅區(qū)B區(qū)
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詳細位置,可以參考上方地址信息
求職提示:用人單位發(fā)布虛假招聘信息,或以任何名義向求職者收取財物(如體檢費、置裝費、押金、服裝費、培訓費、身份證、畢業(yè)證等),均涉嫌違法,請求職者務必提高警惕。
職位發(fā)布者
孫莉君/..HR
成都芯源系統(tǒng)有限公司
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電子技術·半導體·集成電路
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1000人以上
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公司性質(zhì)未知
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高新區(qū)綜合保稅區(qū)科新路8號
應屆畢業(yè)生
學歷不限
2026-01-09 13:33:53
815人關注
注:聯(lián)系我時,請說是在四川人才網(wǎng)上看到的。
